Two neurotechnology teams unveiled complementary platforms for high-density brain interfacing. One group reported a scalable, minimally invasive, high-resolution brain-computer interface (BCI) that reduces surgical burden while increasing electrode coverage. Another team described modular, high-density cortical microelectrode arrays that can be assembled to scale coverage and improve neural decoding and stimulation. Both approaches target clinical neuroprosthetics and neuromodulation applications by balancing implantation risk against signal fidelity. The modular array work emphasizes manufacturability and assembly, while the BCI report focuses on surgical pathways and patient tolerability. Regulatory and clinical adoption will hinge on long-term biocompatibility, implant durability, and demonstrated functional benefits in patient populations such as paralysis and sensory restoration.